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News
Simplifying Embedded System Design with CodeFusion Studio and Zephyr RTOS
1+ week, 4+ day ago (607+ words) Home » Embedded Systems » Simplifying Embedded System Design with CodeFusion Studio and Zephyr RTOS Building embedded systems doesn’t have to mean months of low‑level driver development and complex software integration. Modern microcontroller (MCU) ecosystems can be used to move quickly…...
Kioxia and Sandisk Plan $31B Japan Investment to Expand NAND Capacity
1+ week, 6+ day ago (293+ words) Home » Memory » Kioxia and Sandisk Plan $31B Japan Investment to Expand NAND Capacity Kioxia and Sandisk plan more than $31 billion in Japanese investments through 2032, targeting advanced NAND production and supply stability. The planned investment will support infrastructure expansion at Kioxia’s Yokkaichi…...
Uniform x86 Cores for Real-Time AI: Reducing the Hybrid-Core Tax in Physical AI Systems
2+ week, 3+ day ago (839+ words) Home » AI » Uniform x86 Cores for Real-Time AI: Reducing the Hybrid-Core Tax in Physical AI Systems Why hybrid x86 cores miss robotics deadlines: timing drift from P/E core mixing, unequal AVX width, and CPU-GPU copies. AMD Ryzen AI Embedded X100 answers with…...
Liquid Cooling Becoming Standard for High-end AI Infrastructure
2+ week, 5+ day ago (324+ words) Home » Market News » Liquid Cooling Becoming Standard for High-end AI Infrastructure Continued investment in AI infrastructure and the rapid iteration of AI chips from NVIDIA, AMD, and Google have pushed the TDP of individual chips above 1kW, according to TrendForce’s latest…...
Rising AI Power Density Drives New Cooling Demands as T-Global Expands in Vietnam
3+ week, 2+ day ago (398+ words) Home » Power Management » Rising AI Power Density Drives New Cooling Demands as T-Global Expands in Vietnam T-Global Technology highlights composite materials and direct liquid cooling as thermal demands increase across AI and high-power electronics. As power density continues to rise…...