A System-Level Approach To Protecting 3D-IC Signal Integrity
By Muhammad Hassan, Mahmoud Mahany, and Mohamed Saleh Fig. 1: TSMC’s CoWoS-S on the left and Intel’s EMIB on the right. Fig. 2: Typical lossy channel loss profile in silicon interposer. The channel’s low-pass frequency response heavily attenuates high-frequency harmonics, blunting the…