3+ day, 40+ min ago   (1316+ words) DRAM equipment spending surges 29% to $37 billion and NAND 28% to $14 billion in 2026, making memory the fastest-growing segment of the $135 billion WFE market. HBM demands larger die sizes and multiple stacked memory dies, consuming disproportionately more wafer capacity than conventional DRAM and…...

2+ week, 4+ day ago   (451+ words) The MX1 presentation was selected through the Hot Chips program committee's technical review process. MX1 integrates three architectural capabilities within a single CXL Type 3 device: Memory expansion — Up to 2 TB of DDR5 across four memory channels connected through CXL 3.2 over PCIe 6.0. SSD-backed capacity — XCENA…...

3+ week, 14+ hour ago   (564+ words) HBM demand is rising fast enough to absorb a growing share of global DRAM capacity. HBM uses far more wafer capacity than conventional DRAM. The memory cycle may turn when DRAM supply growth finally outpaces demand. 10 stocks we like better…...

3+ week, 2+ day ago   (259+ words) As part of the Hong Kong Electronics Fair, the event serves as a bridge between Hong Kong's innovation ecosystem and CES's global network "Hong Kong is a global hub for innovation, entrepreneurship and commerce," said Gary Shapiro, Executive Chair, CTA....

3+ week, 5+ day ago   (289+ words) Once upon a time, 1GB of flash memory was serious capacity (and it wasn't cheap either). In early 2002, the industry was abuzz about JMTek's USBDrive and its up-to-1GB capacity. Today, that same capacity is tiny by consumer standards. Most of Kingston's…...

4+ week, 21+ hour ago   (316+ words) The AI-driven memory chip crisis has a ways to go before its status is downgraded to business as usual. JPMorgan strategist Jay Kwon is making a double bullish call on the entire memory space. First, Kwon thinks the memory chip…...