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Packaging & Memory
Chiplets, 3D IC, HBM stacks, DDR5/PCIe lanes, and bandwidth tradeoffs.
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Samsung and Qualcomm Forge 2.1D Packaging Alliance | TechPowerUp Forums
6+ hour, 56+ min ago (19+ words) Samsung and Qualcomm Forge 2.1D Packaging Alliance techpowerup.com Automated bot check in progress Drag the handle to the target...
Transcend Launches 64 GB DDR5-6400 CUDIMM and CSODIMM Embedded DRAM Modules | TechPowerUp}
5+ hour, 42+ min ago (157+ words) Transcend Launches 64 GB DDR5-6400 CUDIMM and CSODIMM Embedded DRAM Modules techpowerup.com Transcend Launches 64 GB DDR5-6400 CUDIMM and CSODIMM Embedded DRAM Modules - Jan 16th 2026 NVIDIA Reportedly Ends GeForce RTX 5070 Ti Production, RTX 5060 Ti 16 GB Next (210) - Dec 31st 2025 Leaks Predict $5000 RTX 5090 GPUs in 2026 Thanks to…...
Fujitsu Launches Made-in-Japan Next-Generation CPU Fujitsu-MONAKA and Fujitsu MONAKA Server
17+ hour, 11+ min ago (276+ words) Fujitsu Limited today announced that it will begin global sales of its next-generation CPU, FUJITSU-MONAKA, designed and developed in Japan, starting November 2026. This will include sales of the processor as a standalone product to cloud and data center operators and…...
Samsung and Qualcomm Forge 2.1D Packaging Alliance
6+ hour, 56+ min ago (138+ words) TechPowerUp Samsung and Qualcomm Forge 2.1D Packaging Alliance - Jul 3rd 2026 Samsung Readies SSD 990 Value Gen 4 NVMe SSD (67) - Feb 6th 2026 NVIDIA to Use SK hynix and Samsung HBM4 for "Vera Rubin" Without Micron (7) - Sep 13th 2026 AI Firms Are Reportedly Buying NVIDIA RTX 5090 GPUs in Bulk for…...
SK hynix deepens TSMC ties for 3D DRAM, diverges from Samsung
12+ hour, 41+ min ago (471+ words) Hynix pursues logic-foundry DRAM approach with TSMC links while Samsung stays in-house According to the semiconductor industry on the 14th, SK hynix, at the "2026 Future Forum" held on the 8th at the Icheon Campus in Gyeonggi Province, presented as the main directions…...
[News] Kepler Claims HBM Alternative Without EUV Using GlobalFoundries’ 28nm Fabs, 2027 Production
20+ hour, 25+ min ago (281+ words) As the AI boom strains supply and pushes up costs, startups are exploring new ways to expand memory production. According to TechPowerUp, Kepler Computing claims to have developed an alternative approach to HBM based on a new 3D stacking technique and…...
Sandisk recruits engineers in Korea as memory talent race heats up
17+ hour, 58+ min ago (147+ words) digitimes Sandisk recruits engineers in Korea as memory talent race heats up Sandisk Vice President Rajeev Nagabhirava discusses AI memory architecture at the SEMICON Taiwan 2026 Memory Summit. Credit: Sherri Wang Sandisk is making an unusual push into engineering recruitment in…...
Document: Samsung and SK Hynix rejected KEPCO's proposal to prepay ~$18.7B of chip cluster power bills, citing uncertainty over long-term chip demand
18+ hour, 58+ min ago (12+ words) Top news and commentary for technology's leaders, from all around the web....
Long Live the Short King: Why 4-hi HBM Wins
23+ hour, 36+ min ago (571+ words) This report will go through the reasoning behind what’s changed in the capacity equation, demonstrate that often HBM capacity is stranded, and show how this can be a win-win for both labs’ TCO and memory supplier profitability. HBM has been…...
Korea Moves to Localize Optical Tech for AI Data Centers
1+ day, 50+ min ago (360+ words) Seoul Economic Daily The South Korean government is moving to localize optical communication technology for artificial intelligence data centers, or AIDCs As AI data centers grow larger, how quickly tens of thousands of graphics processing units can be connected has…...