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News
HP ZGX Fury Is Now Orderable: GB300 Superchip, 748GB Unified Memory, and a Red Hat AI Factory Plan for the Edge
3+ day, 10+ hour ago (189+ words) Two embedded M.2 slots hang off the Grace CPU on PCIe 5.0 and hold the operating system in a software RAID 1 mirror. Two more M.2 slots come off the PCIe switch inside the ConnectX-8 SuperNIC and serve as a RAID 0 data volume, with…...
Samsung High NA EUV DRAM Set for 2028, With 12-Inch Photomasks and a Mistral AI Series D Lead
3+ day, 11+ hour ago (523+ words) Samsung Electronics made two moves in two days that both point at the same problem: keeping its memory and foundry lines on the leading edge as AI demand outruns conventional scaling. On September 8, Samsung and ASML announced an expanded partnership…...
Sandisk Tapes Out Its First HBF Memory Die, Targets 2027 for Inference Product Samples
3+ week, 4+ day ago (235+ words) Sandisk has taped out the first High Bandwidth Flash memory die. The company put it on a slide at its 2026 Investor Day on August 13, under the header HBF Roadmap, next to what the slide labels an actual die picture. The…...
Micron and SK hynix Commit Billions to Memory Capacity, but Almost Nothing Lands Before 2028
3+ week, 5+ day ago (618+ words) Two of the three big memory makers are putting money into U.S. semiconductor infrastructure at opposite ends of the production chain. Micron committed up to $3 billion to domestic supply-chain investments in July, anchored by a raw silicon wafer deal in Texas,…...