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News
[News] Kepler Claims HBM Alternative Without EUV Using GlobalFoundries’ 28nm Fabs, 2027 Production
6+ hour, 45+ min ago (281+ words) As the AI boom strains supply and pushes up costs, startups are exploring new ways to expand memory production. According to TechPowerUp, Kepler Computing claims to have developed an alternative approach to HBM based on a new 3D stacking technique and…...
Samsung Electronics and ASML expand strategic collaboration for next-generation semiconductor manufacturing
10+ hour, 37+ min ago (316+ words) dqindia.com Samsung Electronics and ASML expand strategic collaboration for next-generation semiconductor manufacturing Samsung Electronics further reinforces the leadership with planned high NA EUV adoption for future DRAM manufacturing for the first time in the industry Samsung Electronics and ASML…...
ORNL and Mazak develop hybrid VC-Ez WAAM platform
3+ day, 17+ hour ago (264+ words) The system also integrates an automated palletized transfer system from Mazak, which facilitates the movement of pallets between each production step and reduces the need for operator intervention. The Mazak machining systems are themselves equipped with MAZATROL SmoothEz5 for easy programming…...
Intel reports more than 1 million High-NA wafers—but stitching remains the hurdle
3+ day, 15+ hour ago (1013+ words) Intel reports more than 1 million High-NA wafers, but stitching and mask limits still shape the real manufacturing significance of the milestone. Intel reported in September 2026 that it had processed more than 1,000,000 300-mm wafers through High-NA EUV scanners. That is a…...
[News] Chinese AI Chipmakers Reportedly Hike Prices on HBM Costs, Huawei 950DT Up as Much as 50%
3+ day, 22+ hour ago (461+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Chinese AI Chipmakers Reportedly Hike Prices on HBM Costs, Huawei 950DT Up as Much as 50% Rising memory costs are adding…...
Zuken-TSMC Alliance Highlights Push Toward Integrated Chiplet Design Workflows
3+ day, 22+ hour ago (47+ words) openPR.com Zuken-TSMC Alliance Highlights Push Toward Integrated Chiplet Design Workflows Press release from: Factmr Permanent link to this press release: You can edit or delete your press release Zuken-TSMC Alliance Highlights Push Toward Integrated Chiplet Design Workflows here...
Makera Showcases Desktop CNC Innovation at IFA 2026, Celebrating Multiple Best of IFA Media Honors
4+ day, 2+ hour ago (110+ words) PA Media Makera Z1 Debuts at IFA 2025, Wins Innovation Award, and Prepares for Global Launch Makera Brings CNC Innovation to IFA 2025 ToolDance Unveils X1 Smart Desktop CNC Mill at IFA 2026 Creality Unveils K2 Pro and Nexbie, Delivering an Immersive Experience on Opening Day…...
Chinas AI chipmakers raise prices as high-bandwidth memory shortage bites
4+ day, 3+ hour ago (605+ words) Sept 10 - Chinese AI chipmakers including Huawei Technologies and Cambricon have sharply raised prices for current and next-generation AI processors, three people familiar with the matter said, as soaring costs for high-bandwidth memory squeeze efforts to build domestic alternatives to Nvidia....
Semiconductors: ASML Prepares High-NA EUV for Large Data Center Chips
4+ day, 13+ hour ago (361+ words) ASML aims to adapt its next generation of High-NA EUV machines to larger masks to manufacture massive chips destined for data centers. The Dutch group targets a pilot line in 2031 and large-scale production in 2033. Dutch manufacturer ASML announced on 8 September…...
Besxar Is Turning SpaceX Rocket Boosters Into Flying Chip Factories
4+ day, 15+ hour ago (383+ words) Besxar, founded by ex-OpenAI staffer Ashley Pilipiszyn, flew two microwave-oven-sized 'Fabships' on a SpaceX Falcon 9 booster in July 2026, using the eight minutes above the Karman line as a free space-grade cleanroom. The flown wafers came back with less particulate contamination…...